Dyna-Purge
Commercial purging solutions for color changes, resin changes, screw & barrel cleaning, shutdown/start-up and preventive maintenance in thermoplastic processing.
Select by temperature & application
Use this table for initial guidance. Final grade selection should be confirmed against resin, machine, runner design and actual cleaning objectives.
| Grade | Processing Temperature | Key Positioning | Applications | Typical Resin Focus |
|---|---|---|---|---|
| D2 | 160–329°C | Broad range / versatile | Injection, profile, sheet, cast film, compounding, blow molding | Broad resin range |
| L | 143–329°C | Low viscosity / high-cavitation / automation | Injection + multiple extrusion processes | Broad application range |
| E4 | 302–379°C | High-temperature engineering resins | Injection, profile, sheet, cast film, compounding | PEEK, PEI, PPS, PPA, PSU etc. |
| A | 160–260°C | Polypropylene-focused | Injection & extrusion | PP / PP-based systems |
| C | 193–310°C | Clear / low-residue applications | Injection & extrusion | PET(G), GPPS, PC, SAN, PMMA etc. |
| K | 143–287°C | Lower-temperature applications | Injection & extrusion | Lower-temperature / softer-material processes |
The ranges above are an initial selection framework based on current manufacturer information; GKTECH will confirm against actual machine conditions before recommendation.
Dyna-Purge grades by application
Use the summaries below to shortlist a grade by processing temperature, resin family and cleaning objective.
A versatile grade for color changes, resin changes, preventive maintenance and cleaning before manual teardown.
- Temperature: 160–329°C
- Applications: injection, profile, sheet, cast film, compounding, blow molding
- Resin focus: broad resin range
Designed for stack molds, high-cavitation tooling and automated processes that benefit from a low-viscosity, moldable purge.
- Temperature: 143–329°C
- Applications: injection and multiple extrusion processes
- Key strength: lower-residue formula for faster color transitions
Designed for elevated heat profiles and engineering polymers such as PEEK, PEI, PPS, PPA and PSU.
- Temperature: 302–379°C
- Applications: injection, profile, sheet, cast film, compounding
- Reference minimum clearance: 0.75 mm
A hybrid formulation specifically positioned for PP and PP-based resin systems, especially for color changes and preventive maintenance.
- Temperature: 160–260°C
- Applications: injection and extrusion
- Resin focus: PP / PP-based systems
Designed for changeovers into clear resins and for preventive maintenance where low residue is important.
- Temperature: 193–310°C
- Applications: injection, profile, cast film, sheet, compounding, blow molding
- Resin focus: PET(G), GPPS, PC, SAN, PMMA and related clear resins
Positioned for flexible PVC, TPE, TPO, TPR, TPV, TPU and other lower-temperature or softer resin systems.
- Temperature: 143–287°C
- Applications: injection, profile, sheet, cast film, compounding
- Resin focus: softer and flexible materials
Not sure which Dyna-Purge grade to use?
Send your resin, processing temperature, machine type, runner design and current issue. GKTECH can help shortlist a suitable grade.